| Mfr. No: | 228-7396-55-1902 |
| Mfr.: | 3M Electronic Solutions Division |
| Category: | IC & Component Sockets |
| Description: | IC & Component Sockets BURN-IN SOIC SOCKET 28 Leads |
| Lifecycle: | Active |
| Type | SOIC |
| Number of Positions or Pins (Grid) | 28 (2 x 14) |
| Pitch - Mating | - |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | - |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | - |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 30.0µin (0.76µm) |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polyethersulfone (PES), Glass Filled |
| Operating Temperature | -55°C ~ 150°C |
| Packaging | Bulk |
| Standard Pack Qty | 10 |
| Category | IC & Component Sockets |
| RoHS | RoHS Compliant |
| Lifecycle | |
| Lead Time | 97 Days (from factory) |
| Country / Standard | Code |
|---|---|
| CNHTS | 8538900000 |
| CAHTS | 8536690020 |
| USHTS | 8536694040 |
| JPHTS | 853669000 |
| KRHTS | 8536691000 |
| TARIC | 8536693000 |
| MXHTS | 8536699999 |
| BRHTS | 85366990 |
| ECCN | EAR99 |
3M Electronic Solutions Division manufactures the 228-7396-55-1902, an ic & component sockets part used in electronic assemblies. Its datasheet lists type: SOIC, number of positions or pins: 28 (2 x 14), pitch, mating: -, contact finish, mating: Gold, contact finish thickness, mating: - and contact material, mating: Beryllium Copper. This part has a typical lead time of 97 Days from factory. You can source 228-7396-55-1902 through Simplytronix, with fast shipping and verified authenticity.