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24-6554-16 Aries Electronics
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24-6554-16

Mfr. No: 24-6554-16
Mfr.: Aries Electronics
Category: IC & Component Sockets
Description: IC & Component Sockets DIP TEST SOCKET
Lifecycle: Active
Datasheet: 24-6554-16 Datasheet (PDF)
⚙ Specifications
Type DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 24 (2 x 12)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Nickel Boron
Contact Finish Thickness - Mating 50.0µin (1.27µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Nickel Boron
Contact Finish Thickness - Post 50.0µin (1.27µm)
Contact Material - Post Beryllium Copper
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature -
📦 Product Attributes
Packaging
Standard Pack Qty 10
🔁 Alternate / Replacement Parts
Alternate Packaging
Suggested Replacement
6,028
Units In Stock
📦
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🔑 Key Specifications
Category IC & Component Sockets
RoHS RoHS Compliant
Lifecycle
Lead Time 28 Days (from factory)
📄 Documentation
⬇ Download Datasheet
🌐 Compliance & Export
Country / Standard Code
CNHTS 8538900000
CAHTS 8536690020
USHTS 8536694040
JPHTS 853669000
KRHTS 8536691000
TARIC 8536693000
MXHTS 8536699999
BRHTS 85366990
ECCN EAR99
ℹ Product Overview

The 24-6554-16 from Aries Electronics falls under the ic & component sockets category. Among its key specs are type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, number of positions or pins: 24 (2 x 12), pitch, mating: 0.100" (2.54mm), contact finish, mating: Nickel Boron, contact finish thickness, mating: 50.0µin (1.27µm) and contact material, mating: Beryllium Copper. This part has a typical lead time of 28 Days from factory and ships with a full manufacturer datasheet available for download. 24-6554-16 is available through Simplytronix, sourced and verified for authenticity.

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