| Mfr. No: | iW-HSKALU-CLASLR-CU02 |
| Mfr.: | iWave Global |
| Category: | Heat Sinks |
| Description: | Heat Sinks Arria 10 SoC SOM module heatsink |
| Lifecycle: | Active |
| Type | Top Mount |
| Package Cooled | FPGA |
| Attachment Method | Bolt On |
| Shape | Rectangular, Fins |
| Length | 3.740" (95.00mm) |
| Width | 2.953" (75.00mm) |
| Diameter | - |
| Fin Height | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | - |
| Thermal Resistance @ Natural | - |
| Material | Aluminum |
| Material Finish | - |
| Packaging | |
| Standard Pack Qty | 1 |
| Category | Heat Sinks |
| RoHS | RoHS Compliant |
| Lifecycle | |
| Lead Time | 56 Days (from factory) |
| Country / Standard | Code |
|---|---|
| CAHTS | 8473309000 |
| USHTS | 8473305100 |
| JPHTS | 847330090 |
| MXHTS | 8473300499 |
| ECCN | EAR99 |
iWave Global manufactures the IW-HSKALU-CLASLR-CU02, a heat sinks part used in electronic assemblies. Notable characteristics of this part include type: Top Mount, package cooled: FPGA, attachment method: Bolt On, shape: Rectangular, Fins, length: 3.740" (95.00mm) and width: 2.953" (75.00mm). This part has a typical lead time of 56 Days from factory. You can source IW-HSKALU-CLASLR-CU02 through Simplytronix, with fast shipping and verified authenticity.