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iW-HSKALU-CLASLR-CU02 iWave Global
*For representation only.

iW-HSKALU-CLASLR-CU02

Mfr. No: iW-HSKALU-CLASLR-CU02
Mfr.: iWave Global
Category: Heat Sinks
Description: Heat Sinks Arria 10 SoC SOM module heatsink
Lifecycle: Active
⚙ Specifications
Type Top Mount
Package Cooled FPGA
Attachment Method Bolt On
Shape Rectangular, Fins
Length 3.740" (95.00mm)
Width 2.953" (75.00mm)
Diameter -
Fin Height 1.181" (30.00mm)
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow -
Thermal Resistance @ Natural -
Material Aluminum
Material Finish -
📦 Product Attributes
Packaging
Standard Pack Qty 1
🔁 Alternate / Replacement Parts
Alternate Packaging
Suggested Replacement
10,073
Units In Stock
📦
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🔑 Key Specifications
Category Heat Sinks
RoHS RoHS Compliant
Lifecycle
Lead Time 56 Days (from factory)
📄 Documentation
Datasheet not available
🌐 Compliance & Export
Country / Standard Code
CAHTS 8473309000
USHTS 8473305100
JPHTS 847330090
MXHTS 8473300499
ECCN EAR99
ℹ Product Overview

iWave Global manufactures the IW-HSKALU-CLASLR-CU02, a heat sinks part used in electronic assemblies. Notable characteristics of this part include type: Top Mount, package cooled: FPGA, attachment method: Bolt On, shape: Rectangular, Fins, length: 3.740" (95.00mm) and width: 2.953" (75.00mm). This part has a typical lead time of 56 Days from factory. You can source IW-HSKALU-CLASLR-CU02 through Simplytronix, with fast shipping and verified authenticity.

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